WDS-750 Optical Alignment BGA Rework Station
parameter Specification:
| Total power |
6800W |
| Upper heating power |
1200W |
| Bottom heating power |
1200W |
| Bottom IR heating power |
4200W(2400W is controlled) |
| Power supply |
(Single Phase) AC 220V±10 50Hz |
| Location way |
Optical camera+ V-shape card slot + laser position for fast location |
| Temperature control |
High precision K sensor closed loop control,independent temperature control with ±1 ℃ precision |
| Appliance selection |
High sensitive touch screen + temperature control mode +Panasonic PLC +step driver |
| Max. PCB size |
550×480mm |
| Min. PCB size |
10×10mm |
| Sensor |
4units |
| Chip amplification multiple |
1-200X |
| PCB thickness |
0.5-8mm |
| Chip size |
0.2*0.4mm-9cm |
| Min. chip space |
0.15mm |
| Max. mount loading |
100G |
| Mount precision |
±0.01mm |
| Overall size |
L670×W770×H900mm |
| Optical camera |
Can be removed front and back,left and right,prevent the dead angle |
| Machine weight |
90kg |
Features:
1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;
2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield;
3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;
4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;
5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;
6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 ℃；
7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;
8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;
9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;
10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).
Product Tags:
|
|
WDS-750 Laser BGA Reballing Machine 6800W AC 220V for Ball Grid Array Package Repair Images
|
